Solder Paste Height Measurement Machine
Solder Paste Height Measurement Machine. Solder paste mixer / centrifuge machine; 2d solder paste inspection machine can only measure the height of a certain point on the solder paste, 3d spi can measure the solder paste height of the whole pad, more can reflect the real solder paste thickness.
A solder inspection machine is a computerized machine used to find out the variety of solder paste defects, such as area, height, volume, shape, bridge, shift, and it also helps identifies other defects, nodules, scratches, and strains. Solder paste inspection equipment from the leading manufacturers is listed here. The measurement and image data from the spi can be fed back to the solder paste printer (closed loop) and simultaneously transferred onto the automatic placement machine (closed forward loop) so it can adjust the placement position to the actual solder paste.
For The Lgas, Solder Joints Formed With Higher Paste Volume.
The platform can be rotated 30 degrees at most, and the precision can be kept all the way when repeat works. Easy to locate pcb board, high flexibility ensure high printing precision. Tarr (2) describes in detail the constituents of solder paste and.
Can Be Used For Inspection, Length, Angle And Circle Measurement.
Primary factors include composition and rheology of the paste, stencil used and the type of squeegee and process conditions used to lay the paste down. The most common methods used to measure the solder paste height in 3d spi are phase shift moiré and laser triangulation methods. 150um(padheightof150umas the reference) 最小测量大小smallest measuring size:
Real Time Display Of Std.
1 x pinter 1 x manual working area: The p rinciple of optics and the The technique of structured light has been used to measure the height of solder paste bumps on surface mount printed wiring boards.
Surface, Height Profile, And Volume.
Solar inverter, ups, photo voltaic modules; 2d solder paste inspection machine can only measure the height of a certain point on the solder paste, 3d spi can measure the solder paste height of the whole pad, more can reflect the real solder paste thickness. The measurement and image data from the spi can be fed back to the solder paste printer (closed loop) and simultaneously transferred onto the automatic placement machine (closed forward loop) so it can adjust the placement position to the actual solder paste.
Area/Volume Of Solder Paste Printing.
Solder paste printing is a complicated process and many factors can contribute to the true height being different than target. Solder paste inspection (spi) is a key inspection equipment to control the solder paste printing quality in smt. The solder paste printing machine used for this experiment is a speedline technologies, model mpm up3000.
Post a Comment for "Solder Paste Height Measurement Machine"